CERAMIC PCB ASSEMBLY (HTCC/MTCC)

1st Stage

Screen print to circuit design interconnects and isolation pads at the conductor points onto a substrate of 96% pure Alumina or PCB board.

2nd Stage

Loading the printed solder board to placement machine for components/chip and wire process. Reflow the mounted product board follow the standard reflow profile specification.

3rd Stage

Continues to customer demand for process cutting, coating, electrical open/ short test ,rework or replace rejected board and fully visual inspection

Final Stage

Final, attachment of edge connectors or encapsulation into ceramic/metal package, whichever is appropriate.

Ceramic PCB Process

CW Printing Machine

Use for printing purposes of dielectric and conductor on ceramic

BTU Furnace

Use for curing the Dielectric and conductor on the ceramic substrate
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