SURFACE MOUNT TECHNOLOGY

Capability

Capability

  1. Our quick 3 day Quick Turnaround (Min 5 to 20000 pcs depend on the per/board)
  2. IC ( QFP / BGA / uBGA / QFN / CSP )
  3. Odd Shape Components
  4. Leaded / Lead Free Reflow ROHS
  5. In-Line system
  6. 01005 Passives (0.25X0.12mm)
  7. Capable to handle thin board 0.2 mm   / Flex circuit board.
  8. Emboss Printing

GKG Automatic Screen Printer

  • 2D Inspection
  • Auto cleaning system
  • Fine pitch printing
  • Emboss Stencil Printing
GKG Printer
Juki Machine

JUKI High Speed Flexible Mounter

  • Capable to mount smallest 01005 SMD components
  • IC ( QFP / BGA / uBGA / CSP )
  • 20 different IC trays

TAMURA Reflow Oven

  • ROHS compliance
  • Lead-free solder reflow
  • Capable to reflow 01005 components, shield and high density parts
tamura